SiO₂ 99.98% · D50 0.38 µm — Chemically Synthesized Submicron Ultra-High-Purity Nano Spherical Silica (SN-SPH-300)
SN-SPH-300 Ultra-High-Purity Nano Spherical Silica is a submicron perfectly spherical SiO₂ powder produced by a sol-gel-based chemical synthesis process. It simultaneously delivers an ultra-fine mean particle size of D50 0.38 µm and an ultra-high SiO₂ purity of 99.98% (typical), with a fully amorphous structure that ensures excellent thermal and chemical stability.
It is used as a high-reliability filler for the most advanced semiconductor packaging — including M7-class high-density substrates, EMC (Epoxy Molding Compound), underfill, and FO-WLP / FC-BGA advanced packaging. Its near-perfect spherical morphology enables significantly higher filler loading in resin systems while keeping slurry and compound viscosity low. Extremely low metallic and ionic impurities (Fe 1.5 ppm, Cl⁻ 0.9 ppm, Na⁺ 1.7 ppm) suppress alpha-particle emission and ionic migration, contributing to soft-error reduction and long-term reliability in HBM, DDR5 and AI semiconductor devices.
With a narrow, uniform particle size distribution (D100 ≤ 0.8 µm), a stable specific surface area (~8.5 m²/g), and washed-process-controlled low electrical conductivity (EC 8.9 µS/cm), SN-SPH-300 delivers optimized performance for the most demanding electrical, electronic and energy-material applications — including 5G / millimeter-wave high-frequency substrates, low-Dk CCL / prepregs, thermally conductive silicones, precision ceramics, optical films, and ceramic-coated separators for lithium-ion batteries.
Key Features
- 🧪 Ultra-High Purity SiO₂ 99.98% — Chemically synthesized — beyond semiconductor-grade purity
- ⚪ Perfectly Spherical · Submicron — D50 0.38 µm · D100 ≤ 0.8 µm — top-class sphericity and fineness
- 🧼 Ultra-Low Ionic / Metallic Impurities — Fe 1.5 ppm · Na⁺ 1.7 ppm · Cl⁻ 0.9 ppm — suppresses soft errors & migration
- 🔬 Fully Amorphous — Low CTE · excellent thermal-shock and chemical stability
- 💧 Low Electrical Conductivity — Controlled by precision washing — ideal for high-reliability electronics
- ⚡ Low-Dk / Low-Viscosity Filling — High loading with low dielectric constant and viscosity — for 5G / AI semis
Technical Specifications
| Item | Value |
|---|---|
| Product Code | SN-SPH-300 |
| Appearance | White nano-fine powder |
| Morphology | Perfectly spherical (Amorphous) |
| Process | Chemical Synthesis (Sol-Gel) |
| SiO₂ (Purity) | 99.98 % (typical) |
| Fe | 1.5 ppm |
| Cl⁻ | 0.9 ppm |
| Na⁺ | 1.7 ppm |
| Mean Particle Size D50 | 0.38 µm |
| Max Particle Size D100 | ≤ 0.8 µm |
| Specific Surface Area | 8.5 m²/g |
| Moisture | 0.12 % |
| PH | 6.1 |
| Electrical Conductivity (EC) | 8.9 µS/cm |
| Packaging | 5 / 10 kg bag · OEM available |
| Note | PSD and surface treatment can be customized upon request |
| Country of Origin | China |
Main Applications
Underfill & Encapsulant
Parent Category: Spherical Silica Powder
Particle size, purity, surface treatment and packaging can be customized to your specification. Contact us for samples, TDS and quotations.