High Sphericity · Low Viscosity · Low CTE — Premium Spherical Silica for Semiconductor EMC
Spherical Silica Powder is a high-purity amorphous SiO₂ powder formed into perfect spheres via a flame-fusion process. Thanks to its low resin viscosity, excellent flowability and low CTE, it is used as a key filler in advanced electronic materials such as semiconductor EMC (Epoxy Molding Compound), CCL, underfill and encapsulants. Supplied in two grades: standard SN-QG and low-alpha SN-QG-L.
Key Features
- 🔵 High Sphericity — Flame-fusion / Si-deflagration / chemical synthesis produces near-perfect spheres
- 🧪 High-Purity SiO₂ 99.0–99.95% — Low Na⁺/Cl⁻/E/C ensures semiconductor EMC reliability
- 🌡️ Low CTE & Low Thermal Conductivity — Excellent CTE match with silicon wafer — minimizes cracking and delamination
- ☢️ Low-Alpha Grade (SN-QG-L) — Low radioactive element content — prevents soft errors in advanced memory
- ⚙️ High Loading & Low Stress — Spherical shape and low SSA maintain low viscosity/stress at high loading
- 📐 Precise PSD Control — D50 0.1–40 µm (SN-QG) or 1–30 µm (SN-QG-L) customizable
Technical Specifications
| Item | Value |
|---|---|
| Appearance | White spherical powder |
| SiO₂ Purity | 99.0 ~ 99.95 % |
| Morphology | Spherical |
| PH | 5 ~ 8 |
| Mean Particle Size D50 | 0.1–40 µm (SN-QG) / 1–30 µm (SN-QG-L) |
| Features | Low Na⁺/Cl⁻/E/C · high sphericity · low stress |
| Packaging | 10 / 20 kg bag · OEM |
| Country of Origin | China |
Product Lineup
- SN-QG · SN-QG · Standard Spherical Silica Powder — Standard Spherical
- SN-QG-L · SN-QG-L · Low-Alpha Spherical Silica Powder — Low-Alpha Spherical
- SN-SPH-300 · SN-SPH-300 · Ultra-High-Purity Nano Spherical Silica — Chemically Synthesized Submicron Spherical (D50 0.38 µm · SiO₂ 99.98%)
- SN-SPJ-300 · SN-SPJ-300 · Submicron Spherical Silica — 98% Spheroidization Submicron Spherical (D50 0.3±0.1 µm · SiO₂ >99.9%)
- SN-FPO10 · SN-FPO10 · High-Purity Spherical Fused Silica — High-Purity Spherical Fused Silica (D50 9.96 µm · SiO₂ 99.93%)
- SYN-SPH · Synthetic Spherical Silica — Chemically Synthesized Spherical (D50 20 nm–2 µm · SiO₂ ≥99.995%)
Main Applications
Semiconductor EMC (Encapsulant) · CCL / PCB Substrate · Underfill & Encapsulant · High Thermal Conductivity Materials
Particle size, purity, surface treatment and packaging can be customized to your specification. Contact us for samples, TDS and quotations.