SiO₂ 99.96% · D50 3.8 µm — Ultra-High-Purity Micronized Fused Silica for Semiconductor & Electronic Materials (SN-HF04)
SN-HF04 is an ultra-high-purity amorphous fused silica powder produced by melting selected high-grade quartz at approximately 2,000℃ and then precision-milling and classifying it into a narrow micronized particle size distribution. It offers a typical SiO₂ purity of 99.96% (spec ≥99.95%), extremely low iron content (Fe₂O₃ ~12 ppm), Al₂O₃ below 100 ppm, and a tightly controlled PSD of D10 1.6 µm / D50 3.8 µm / D90 6.6 µm. With a very low CTE (~0.5×10⁻⁶/℃), low dielectric constant and loss, and outstanding chemical stability, SN-HF04 is an optimized premium filler for the most demanding advanced electronic, optical and energy materials — including semiconductor EMC, underfill, encapsulants, advanced packaging (FO-WLP, FC-BGA), CCL / PCB prepreg, 5G / high-frequency substrates, thermally conductive silicones, LED / OLED encapsulation, and precision ceramics and quartz-glass raw material.
Key Features
- 🧪 Ultra-High Purity SiO₂ 99.96% — Spec ≥99.95%, typical 99.96% — semiconductor-grade purity
- 🧼 Ultra-Low Metallic Impurities — Fe₂O₃ ~12 ppm · Al₂O₃ ~100 ppm — minimizes soft errors and yield loss
- 🔬 Fully Amorphous Fused Structure — Fully amorphous · low CTE (~0.5×10⁻⁶/℃) · excellent thermal-shock resistance
- 📐 Precise Micronized PSD — D10 1.6 / D50 3.8 / D90 6.6 µm — narrow uniform PSD for high loading & low viscosity
- ⚡ Low-Dk / High-Insulation — Low Dk/Df and superior insulation — ideal for 5G / high-frequency substrates
- 🛡️ Excellent Chemical Stability — Resistant to virtually all acids, alkalis and solvents except HF
- 💧 Low Moisture Control — Moisture ≤ 0.2% (typ. 0.13%) — prevents voids/cracks during molding & curing
- 🔧 Customizable PSD — D50 and distribution can be tailored to the customer's process
Technical Specifications
| Item | Value |
|---|---|
| Product Code | SN-HF04 |
| Appearance | White fine powder |
| Morphology | Amorphous Fused |
| SiO₂ (Purity) | ≥ 99.95 % (typ. 99.96 %) |
| Al₂O₃ | ~100 ppm |
| Fe₂O₃ | ~12 ppm |
| Moisture | ≤ 0.2 % (typ. 0.13 %) |
| Particle Size D10 | 1.6 µm |
| Particle Size D50 | 3.8 µm (spec 4 ± 1 µm) |
| Particle Size D90 | 6.6 µm |
| CTE | ~0.5 ×10⁻⁶ /℃ |
| Mohs Hardness | ~7 |
| True Density | ~2.2 g/cm³ |
| PH | 5 ~ 8 |
| Features | Low Na⁺/Cl⁻/E/C · low CTE · low-Dk · high insulation |
| Packaging | 10 / 20 kg bag · OEM available |
| Note | PSD can be adjusted upon customer request |
| Country of Origin | China |
Main Applications
Semiconductor EMC (Encapsulant) · Underfill & Encapsulant · Advanced Packaging · CCL / PCB Substrate · High Thermal Conductivity Materials
Parent Category: Silica Powder & Granule
Particle size, purity, surface treatment and packaging can be customized to your specification. Contact us for samples, TDS and quotations.